Tin and tin profiles

Spherical Solder Powder

Standard:GB/T 29089Property:Silver white spheridal powder with good shape and low oxygen level.Variety:As for tin-lead powder Sn63PbA, Sn62PbAg2, lead-free powder SnAg3Cu0.7, SnSb5, please refer to those listed in the standard. Other customized products are also available.Specification:3#(25~45μm)、4#(20~38μm)、5#(15~25μm)etc. Other specifications are also avaiable.Packaging:In al...

BGA (Ball Grid Array) Solder Ball

Standard:Q3-QA-13Variety:SnAgCu, SnPbProperty:Granular metalGauge:0.9mm≧Ø≧0.17mm.Packaging:packed in anti static bottles. Packaging weight is as per the specific gravity of the metal. Take product with gauge of SnAg3Cu0.5-0.760mm for example, it is 0.5kk per bottle, 10 bottles per packet, 4 packets per carton; each 1kk equals to 1.70kg.Application:It is used for BGA/CSP/Flip Chip. It function...

Tin Anode, Solder Anode

Standard:GB/T 728 GB/T 8012 GB/T 3131Variety:As for Sn99.99A, Sn99.90AA, Sn63PbA, please refer to those listed im the standard. Other customized prodrcts are also available.Properties:It is a silver-white geometric metal.Shapes:plate, ball, rhombic bar, octagonal bar, stellate bar, rectangular bar. Other shapes and lengths are available at the request of customers.Packaging:in wooden case ...

The series of YW9 lead-free solder paste

Standard:IPC/ANSI J-STD-004 & 5 & 6Grade:Conventional lead-free solder paste YW9-3005-98CY04, low silver lead-free solder paste YW9-0307-98US03.Properties:Gray paste. The product has stable printing features, long time printing has little effect on viscosity, it can be adopted to high-speed printing and fine pitch processes. The product is no-clean type, residue after reflow is minimal, sold...

The series of YW4 low-temperature solder paste

Standard:IPC/ANSI J-STD-004 & 5 & 6Variety:Eutectic low-temperature solder paste YW4-4258-98OK02Properties:Gray paste. The product is no-clean type, residue after reflow is minimal, and it has stable features for continuous printing, solder joint is good glossed after welding, intensity is high, and conductivity is excellent.Specification:IPC Type 3 or 2.5 Spherical solder powder mixed with...

YT63 SnPb eutectic solder paste

Standard:IPC/ANSI J-STD-004 & 5 & 6Variety:eutectic lead-containing solder paste YT63-L37-98KM03Properties:gray paste. The product is no-clean type, residue after reflow is minimal, solder joint is good glossed after welding, intensity is high, and conductivity is excellent.Specification:IPC Type 3 or 2 Spherical solder powder mixed with paste flux fluids.Packaging:Packed in wide-mouthed p...

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Yunnan tin Limited by Share Ltd
ICP filing number: Dian ICP preparation No. 05000865