BGA (Ball Grid Array) Solder Ball

September 9, 2018

Standard:Q3-QA-13

Variety:SnAgCu, SnPb

Property:Granular metal

Gauge:0.9mm≧Ø≧0.17mm.

Packaging:packed in anti static bottles. Packaging weight is as per the specific gravity of the metal. Take product with gauge of SnAg3Cu0.5-0.760mm for example, it is 0.5kk per bottle, 10 bottles per packet, 4 packets per carton; each 1kk equals to 1.70kg.

Application:It is used for BGA/CSP/Flip Chip. It functions as circuits interconnect, welding, mechanical support, and I/O bump, etc.

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ICP filing number: Dian ICP preparation No. 05000865