Standard：IPC/ANSI J-STD-004 & 5 & 6

Grade：Conventional lead-free solder paste YW9-3005-98CY04, low silver lead-free solder paste YW9-0307-98US03.

Properties：Gray paste. The product has stable printing features, long time printing has little effect on viscosity, it can be adopted to high-speed printing and fine pitch processes. The product is no-clean type, residue after reflow is minimal, solder joint is good gloss after welding and the chip side barely getting solder ball.

Product Specification：IPC Type 4 or 3 Spherical solder powder mixed with paste flux.

Packaging：Packed in wide-mouth polyethylene cans. 500g/can, 10kg/carton, each carton contains refrigerated insulated ice bag.

Application：It can be widely used in SMT reflow soldering process.