Standard：IPC/ANSI J-STD-004 & 5 & 6

Variety：Eutectic low-temperature solder paste YW4-4258-98OK02

Properties：Gray paste. The product is no-clean type, residue after reflow is minimal, and it has stable features for continuous printing, solder joint is good glossed after welding, intensity is high, and conductivity is excellent.

Specification：IPC Type 3 or 2.5 Spherical solder powder mixed with paste flux fluids.

Packaging：Packed in wide-mouthed polyethylene cans. 500g/can, 10kg/carton, each carton contains refrigerated insulated ice bag.

Application：It can be widely used in through-hole, module, syringe dispensing and general reflow soldering process.